Simulation Numérique par Multigrilles des Transferts Conjugués dans les Cartes de Composantes Electroniques = Numerical Simulation by Multigrids of Conjugated Heat Transfer in Electronic EquipmentsWang, Hui Ying; Saulnier, J.B.1991, 244 p.Thesis

Thermal management of electronic systems III (Nantes, 24-26 September 1997)Bardon, J.P; Beyne, E; Saulnier, J.B et al.Eurotherm series. 1998, issn 1248-8313, isbn 2-84299-033-1, 271 p., isbn 2-84299-033-1Conference Proceedings

High-performance cooling techniques for electronic systemsGARIMELLA, S. V.Eurotherm series. 1998, pp 3-15, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Development and application of compact models of packages based on DELPHI methodologyPARRY, J; ROSTEN, H.Eurotherm series. 1998, pp 139-148, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Coupled thermal and flow analysis of a power converter within an integrated CAD/CAE-environmentLEMCKE, C.Eurotherm series. 1998, pp 188-194, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Influence of airflow bypass on the thermal performance and pressure drop of plate fin and pin fin heat sinks for electronics coolingJONSSON, H; PALM, B.Eurotherm series. 1998, pp 44-50, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Status and challenges in thermal design of electronic parts and systemsLASANCE, C. J. M.Eurotherm series. 1998, pp 91-107, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Thermal management in industrial product developmentEGGINK, H. J.Eurotherm series. 1998, pp 115-121, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Main goals and obtained results of the THERMINIC projectCOURTOIS, B; SZELKELY, V; RENCZ, M et al.Eurotherm series. 1998, pp 108-114, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Two-phase heat exchangers applied to power electronics coolingMEYSENC, L; RAËL, S; SCHAEFFER, C et al.Eurotherm series. 1998, pp 58-64, issn 1248-8313, isbn 2-84299-033-1Conference Paper

EDA and CFD tool interoperability : the concurrent design of a PowerPC^TM microprocessor-based microcomputerKROMANN, G; PIMONT, V; ADDISON, S et al.Eurotherm series. 1998, pp 164-171, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Modelling of a power electronic components cooling system with a phase change materialARGOUD, D; SARTRE, V; LALLEMAND, A et al.Eurotherm series. 1998, pp 218-224, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Thermal control of power electronic equipments by liquid cooled cold-platesCESINI, G; RICCI, R; RIPANI, R et al.Eurotherm series. 1998, pp 24-30, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Thermal simulation of aluminum nitride heat spreaders for various advanced electronic packaging applicationsHAHN, R; KAMP, A; HOEHNE, J et al.Eurotherm series. 1998, pp 195-201, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Compact transient thermal models for the polymer stud grid array (PSGA^TM) packageCHRISTIAENS, F; BEYNE, E; VANDEVELDE, B et al.Eurotherm series. 1998, pp 202-209, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Experimental analysis of chimney effect for vertical isoflux symmetrically heated parallel platesBIANCO, N; MANCA, O; MORRONE, B et al.Eurotherm series. 1998, pp 73-79, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Package geometry considerations in thermal compact modeling strategiesADAMS, V. H; BLACKBURN, D. L; JOSHI, Y et al.Eurotherm series. 1998, pp 122-130, issn 1248-8313, isbn 2-84299-033-1Conference Paper

The backward-facing step flow in the transitional regimeFOKKELMAN, W. F; MEINDERS, E. R; HANJALIC, K et al.Eurotherm series. 1998, pp 37-43, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Thermal characterization of electronic boardsPHILIPPI, I; BENDADA, A; REMY, B et al.Eurotherm series. 1998, pp 246-253, issn 1248-8313, isbn 2-84299-033-1Conference Paper

High performance liquid cooled aluminum nitride heat sinksHAHN, R; GLAW, V; GINOLAS, A et al.Eurotherm series. 1998, pp 17-23, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Optimising the solder joint reliability of polymer stud grid array (PSGA^TM) packages using thermo-mechanical analysisVANDEVELDE, B; CHRISTIAENS, F; BEYNE, E et al.Eurotherm series. 1998, pp 172-178, issn 1248-8313, isbn 2-84299-033-1Conference Paper

Thermal characterization of SSOP packagesSLATTERY, O; BARRETT, J; O'FLAHERTY, M et al.Eurotherm series. 1998, pp 254-261, issn 1248-8313, isbn 2-84299-033-1Conference Paper